TSP CO., LTD

TO series

It is a core material that supplies electricity to and supports the semiconductor chip for power semiconductors and serves as a lead that connects an external circuit and a semiconductor chip that supports it and a frame that fixes the semiconductor package to the electronic circuit board.
The TO series is designed for medium voltage MOSFETs and IGBTs used in switching power supplies, AC adapters, and motor drivers, and is the preferred product in the market based on its high quality and reliability.

High Voltage Automotive

High Density Matrix Lead Frame

Module

IPM (Intelligent Power Module) is a product that integrates IGBT and drive IC into a single package, and in particular, it is used in the field of power management in the field of high-capacity motor control, and is a leadframe for power semiconductors that becomes the center of high-efficiency products by reducing energy.

Automotive Module

Motor Control
Intelligent Power Module

Intelligent Power Module

APM Automotive Power Module

High Voltage Automotive

PQFN

As PQFN (Power Quad Flat No-lead) is a product for various high power applications, it exhibits a higher level of performance than general low-power QFN products.
By supplying stable and reliable PQFN Leadframe design, satisfaction of the product is given.

High Density Power QFN

TO series

Module

PQFN

Mold Set / Spare Parts

SEMICONDUCTOR MOLD

SPARE PARTS

SEMICONDUCTOR STAMPING

LEAD FRAME & MODL PACKAGE

Main customers